Thermal science
Microchannel design, enhanced boiling surfaces, hotspot control, and temperature uniformity.
Advanced thermal management R&D company
Enthalux： Cooling Next-Generation AI Accelerators.
Advanced liquid cooling for the AI compute era.
Enthalux develops high-performance single-phase cold plates, microjet dielectric phase-change systems, immersion evaporators, and rack-level cooling architectures for high-power chips and dense computing.
Company
An R&D company focused on cooling management for high-power electronics.
Enthalux works at the intersection of heat transfer, microfluidics, mechanical integration, and deployment engineering. Our focus is practical cooling management for AI accelerators, GPUs, advanced packages, power devices, high-density servers, and data center infrastructure.
The company translates microchannel water-based single-phase cooling, microjet dielectric phase-change cold plates, immersion evaporators, and low-pressure two-phase systems into deployable product and system platforms. We collaborate with Sparkle and Intel to advance practical thermal solutions from component development through system-level integration.
Prototype engineering
Cold plate geometry, vapor return, dielectric fluid handling, sealing, and compact integration.
System verification
Bench testing, closed-loop validation, pressure-drop evaluation, and server/rack architecture work.
Collaborators
Working across the technology ecosystem to accelerate practical cooling innovation.
Sparkle
Intel
Why it matters
AI and HPC systems need the right cooling architecture at every power level.
Higher chip power
AI training, inference, and HPC workloads keep increasing processor power and local heat flux.
Architecture selection
Optimized single-phase loops serve demanding systems efficiently, while two-phase designs extend capacity for extreme heat flux.
Reliability exposure
Leakage risk, service interruption, and maintenance cost become major barriers at data center scale.
System scalability
Cold plate capacity alone is not enough; thermal resistance, seals, pipes, joints, and rack loops matter.
Technologies
Single- and two-phase cooling engineered as complete systems.
Our portfolio combines liquid-cooled microchannel cold plates and distribution systems with low-pressure dielectric phase-change technology. Each architecture is engineered around heat flux, temperature, pressure, reliability, serviceability, and facility conditions.
01
Dielectric liquid inlet
Low-boiling-point dielectric working fluid enters the engineered plate.
02
Microjet distribution
Internal micro-distributors feed microchannels across the heat source.
03
Enhanced phase change
Micro-/nano-structures increase boiling heat transfer and uniformity.
04
Vapor outlet and return
Low-resistance passages route vapor-liquid return toward condensation.
Single-phase cooling systems
Microchannel cold plates, manifolds, coolant distribution, and controls optimized for efficient, reliable heat removal.
Direct-to-chip cold plates
6 kW-class single cold plate cooling for GPUs, AI accelerators, 3DIC packages, and power devices.
Immersion evaporators
Liquid evaporators for immersion systems with high heat-flux chip and power-electronics loads.
Rack cooling architecture
Parallel cold plate connection, vapor-liquid return, centralized condensation, storage, and pumping.
Performance
Reported prototype performance, displayed as engineering parameters.
Thermal load handling
reported prototype values
<0.007 K/W
thermal resistance
<20 kPa
pressure drop at 4000 W
<20 mm
overall cold plate height
>130 W/cm2
immersion evaporator heat flux
| Category | Parameter | Value |
|---|---|---|
| Two-phase cold plate | Single plate cooling power | Over 6,000 W |
| Two-phase cold plate | Heat flux | Above 300 W/cm2 |
| Two-phase cold plate | Thermal resistance | Below 0.007 K/W |
| System | Operating pressure | Below 3 bar |
| System | Pressure drop | Below 20 kPa at 4000 W |
| Mechanical | Cold plate height | Below 20 mm |
| Immersion evaporator | Single-chip heat load | Above 3,000 W |
| Immersion evaporator | Heat flux | Above 130 W/cm2 |
Solution pathways
Match the cooling architecture to the thermal envelope.
Enthalux selects the cooling path from chip heat flux, package geometry, pressure limits, server layout, facility conditions, and service requirements—not from a one-size-fits-all platform.
01
Direct to chip
AI accelerator cold plates
Single-phase microchannel cooling for GPUs, accelerators, 3DIC packages, and high-power devices.
- Best fit
- High-power packages with established facility-water or CDU infrastructure.
- Engineering scope
- Cold plate, manifold, seals, pressure drop, and temperature-uniformity validation.
02
Two phase
Extreme heat-flux cooling
Low-pressure dielectric phase-change cooling for concentrated hotspots and next-generation package power.
- Best fit
- Thermal envelopes that exceed practical single-phase flow, footprint, or pumping limits.
- Engineering scope
- Microjet distribution, enhanced boiling surface, vapor-liquid return, and condensation loop.
03
Immersion
Immersion evaporators
Compact evaporators that remove high local heat loads within dielectric immersion environments.
- Best fit
- Immersion servers where chip-level heat flux requires targeted phase-change enhancement.
- Engineering scope
- Evaporator geometry, fluid compatibility, mounting, vapor management, and bench testing.
04
Rack scale
Dense server and rack integration
System architecture that carries component-level cooling performance through the server and rack.
- Best fit
- Multi-accelerator servers and dense racks requiring coordinated thermal and mechanical design.
- Engineering scope
- Parallel distribution, return routing, condensation, storage, pumping, and service access.
Contact
Start a technical discussion with Enthalux.
Share the chip power map, package size, allowable pressure, coolant and facility conditions, target server form factor, and prototype timeline. The team supports customized cold plate design, prototype testing, and system-level verification.
ContactZhengduo Zhu
Phone (Australia)+61 451 778 535
Phone (China)+86 158 8967 6602